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Interpretation of MOS transistor mismatch signature through statistical device simulations

机译:通过统计设备仿真解释MOS晶体管失配特征

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摘要

Semiconductor manufacturers daily fabricate millions of nominally identical integrated circuits made of supposedly identical components. However controlled the fabrication process can be, two components will always be slightly different when thoroughly compared. The comparison between two components is usually done using a certain parameter as estimator of the integrated circuit (IC) or transistor performance, e.g. a frequency of an oscillator or a current delivered by a transistor. What happens in reality is, for instance, that the frequencies of the identical oscillators fabricated, with the same process but in different foundries, or in different moments in the same foundry, will be different. Actually, even chips fabricated on the same wafer will not be exactly the same, as some fundamental characteristics of the fabrication process vary across the wafer. These sorts of variability are often deterministic. This means that a clear pattern appears after a significant number of observations
机译:半导体制造商每天制造数以百万计的名义上相同的集成电路,这些集成电路由假定相同的元件制成。不管制造过程如何受控,如果将两个组件进行彻底比较,它们总是会略有不同。通常使用某个参数作为集成电路(IC)或晶体管性能的估算器来完成两个组件之间的比较,例如振荡器的频率或晶体管提供的电流。例如,实际发生的情况是,以相同的过程但在不同的代工厂中或在同一代工厂中的不同时刻制造的相同振荡器的频率将不同。实际上,即使在同一晶片上制造的芯片也不会完全相同,因为制造工艺的一些基本特征在整个晶片上都不同。这些类型的可变性通常是确定性的。这意味着经过大量观察后,出现清晰的图案

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